In recent years, research interest in the 3D printing of metal patterns on plastic parts has grown exponentially, due to its high potential in the manufacturing of next-generation electronics. But ...
A new technical paper titled “Omni 3D: BEOL-Compatible 3-D Logic With Omnipresent Power, Signal, and Clock” was published by researchers at Stanford University, Intel Corporation and Carnegie Mellon ...
High-quality laser-pyrolyzed 3D graphene papers were achieved through reaction molecular dynamics simulation and process parameter optimization. By employing stacking integration technique of tandem ...
A new technical paper titled “Three-dimensional integrated metal-oxide transistors” was published by researchers at KAUST (King Abdullah University of Science and Technology). Find the technical paper ...
3D Printing has been gaining traction through many scientific and engineering disciplines as an easy way to print complex hierarchical structures, some of which are not possible by other means. The 3D ...
In a few weeks, Intel will release Ivy Bridge, the first mass-produced 22nm parts, and more importantly the first to use 3D "tri-gate" FinFET transistors. These CPUs will be incredibly fast and use ...
In recent years, research interest in the 3D printing of metal patterns on plastic parts has grown exponentially, due to its high potential in the manufacturing of next-generation electronics. But ...
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