Morning Overview on MSN
MIT’s chip stacking leap could slash energy use for hungry AI chips
Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
IEEE Spectrum on MSN
The ultimate 3D integration would cook future GPUs
D stacking doubles the operating temperature inside the GPU, rendering it inoperable. But the team, led by Imec’s James Myers ...
YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...
After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor transistors.
When existing advanced 2D designs already push the limits of design-for-test (DFT) tools, what hope do developers have of managing DFT for 3D devices? Can anyone afford the tool run time, on-chip area ...
Flexible, hydrogel-based transistors that can host living cells point to a new class of bio-integrated electronics, blurring ...
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