Morning Overview on MSN
MIT’s chip stacking leap could slash energy use for hungry AI chips
Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...
TL;DR: Huawei is set to lead Apple by integrating high-performance HBM DRAM with 3D stacking technology in smartphones, boosting AI efficiency and bandwidth while reducing chip size. Apple plans to ...
IEEE Spectrum on MSN
The ultimate 3D integration would cook future GPUs
D stacking doubles the operating temperature inside the GPU, rendering it inoperable. But the team, led by Imec’s James Myers ...
The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...
Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron. According to reports from TheElec and ZDNet Korea, citing industry sources, ...
By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...
YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...
The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...
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