Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...

Copper interconnect was introduced to the mainstream at 130nm because of its significant advantages compared to aluminum, such as reduction in resistivity and power consumption and resistance to ...

Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...