MUNICH — Electroglas Inc. today at the Semicon Europa trade show here introduced a new test-handling solution for devices in wafer-level packages, unpackaged known-good die products, thin wafers, ...
ATC 2.0 Option Enables Dynamic Multisite Sensing and Regulation of Device Temperature for Optimized Test of High-End Automotive SoCs TOKYO, Oct. 24, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test ...
Advantest Corp. has introduced a test handler for systems-on-a-chip (SOCs) other high-end logic devices that can test up to eight devices at the same time, about twice as fast as the company’s ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results