Standard electronic design automation (EDA) tools can be used to produce a semiconductor layout, which can be used to manufacture a device with targeted performance specifications. Unfortunately, ...
With small geometry silicon processes, additional nonfunctional geometric structures are required to maintain layer planarity during the chemical/mechanical polishing (CMP) phase of processing. The ...
Santa Cruz, Calif. — Every nanometer chip requires dummy metal fill to reduce topology variations caused by chemical mechanical polishing. Startup Blaze DFM Inc. this week will roll out technology ...