The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...

The Business Research Company's Riding The Wave Of Innovation: Ceramic Substrates In Electronic Packaging Global Market Report 2025 It will grow to $7.31 billion in 2029 at a compound annual growth ...

FREUDENSTADT, Germany--(BUSINESS WIRE)--Calumet Electronics (Calumet), a leading American printed circuit board manufacturer, is pioneering the domestic production of advanced packaging substrates.

Dublin, Feb. 25, 2025 (GLOBE NEWSWIRE) -- The "Organic Substrate Packaging Material Market Analysis by Technology, Application, and Region 2025-2033" report has been added to ResearchAndMarkets.com's ...

AUSTIN, Texas--(BUSINESS WIRE)--3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic ...

(MENAFN- EIN Presswire) EINPresswire/ -- What Is The Organic Substrate Packaging Material Market Size And Growth? In recent times, the organic substrate packaging material market size had a consistent ...

Low-cost high-performance flexible substrate materials are now available. Solderable up to 300°C, they come with 1 oz of copper (and other custom thicknesses) on ...

The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...

A technical paper titled “Substrate Embedded Power Electronics Packaging for Silicon Carbide MOSFETs” was published by researchers at University of Cambridge, University of Warwick, Chongqing ...