TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...
Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical enabler for ...
The global Glass Interposers Market is witnessing accelerated demand driven by the rapid evolution of advanced semiconductor packaging, rising adoption of heterogeneous integration, and increasing ...
Samsung Electronics is set to make a dramatic shift in the way it produces chips. The company plans to substitute silicon with glass in a central component of chip packaging by 2028. The new process ...
Samsung plans to replace silicon with glass interposers in AI chip manufacturing by 2028. This groundbreaking shift aims to deliver faster, more efficient AI chips, potentially boosting processing ...
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Laser-written glass chip brings quantum communication to real-world use
Quantum communication has long promised unbreakable encryption, but the hardware has struggled to escape the lab. A new generation of laser-written glass chips is changing that equation, carving three ...
TL;DR: SKC is advancing glass substrate technology for high-performance semiconductors, collaborating with AMD and Amazon AWS on final quality tests. The company plans to increase production capacity ...
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Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...
A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...
As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry ...
Glass Interposers Market Poised for Strong Growth as Advanced Semiconductor Packaging and High-Performance Computing Demand Accelerates: Verified Market Research (R) The global Glass Interposers ...
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