In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

A Pakistani research team has assessed the performance of a passive heat sink cooling technique in two different configurations: one using rectangular fins and one based on circular fins. The ...

TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...

A new line of flared pin fin heat sinks have been introduced by Cool Innovations Inc., (Toronto, Canada) that are designed to provide enhanced cooling power performance due to an innovative structure ...

Ever-increasing levels of heat in today's power electronics necessitate constant efforts to increase heat sink efficiency by expanding the number of extended surfaces (fins) for cooling. Due to the ...

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...

Researchers at Pakistan's U.S. Pakistan Center for Advanced Studies in Energy (USPCASE) and the National University of Sciences & Technology (NUST) have developed a new passive cooling technique for ...

Cool Innovations has introduced a line of flared-pin fin heat sinks featuring an array of sparsely configured round pins that slant outward, a configuration that cools components in natural convection ...