LAS VEGAS, NV, UNITED STATES, January 20, 2026 /EINPresswire.com/ — CIT (CEO Seung Jeong) announced its participation in CES 2026, the world’s largest IT and consumer electronics exhibition, held in ...
TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
Intel announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued ...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...
Samsung Electro-Mechanics pledged to ramp up the portion of sales of its premium chip package substrate known as Flip Chip Ball Grid Array (FCBGA) to 50 percent by 2026 in order to capitalize on the ...
LG Innotek developed the world's first "copper post" technology, a solution needed for the latest smartphones. This technology allows for denser circuitry for smaller, higher-performance semiconductor ...
TOKYO and SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to ...
Integrated circuits require a variety of voltages and a wide range of currents, typically supplied by voltage regulators. But increasing power density is resulting in higher power delivery losses.
Samsung Electro-Mechanics (Semco) on March 21 announced that it will expand its ABF substrate production capacity at its Busan plant, bringing its total investment in the segment to KRW1.6 trillion ...
IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
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