As data rates soar into the multi-gigabit range, high-speed digital (HSD) PCB design is no longer just about connecting the dots. Signal integrity (SI) and power integrity (PI) challenges can silently ...

This signal integrity blog is written by Colin Warwick, High Speed Digital Design Flow Manager with the Agilent EEsof EDA high speed digital (formerly signal integrity) design flow group. He covers a ...

Signal integrity is a critical design consideration in modern electronic systems, particularly those that depend on high-speed interconnects. As data rates climb and interconnect geometries become ...

With the clean transmission of high-speed signals a key priority in today’s electronic products and systems, design engineers continue to face the task of designing and implementing interconnection ...

PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).

BANGKOK, Feb. 28, 2024 /PRNewswire/ -- DuPont will present an extensive range of advanced circuit materials and solutions at Intelligent Asia Thailand 2024. With an extensive portfolio in signal ...