Driving R&D of glass components for scaling of semiconductor packaging substrates Tokyo, Japan, December 16, 2025-- TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN ...

WEST LAFAYETTE, Ind. — It’s official. SK hynix Inc., the world’s leading producer of high-bandwidth memory chips, will invest an estimated $3.87 billion in West Lafayette to build an advanced ...

Industry-leaders will create hub for R&D with prototype production line for 515 x 510mm panel-level organic interposers Resonac will establish an "Advanced Panel Level Interposer Center (APLIC)" as ...

Purdue University President Mung Chiang made it official Wednesday: South Korea-based semiconductor chipmaker SK Hynix Inc. plans to establish a nearly $4 billion advanced packaging fabrication and ...

Quick Read Taiwan Semiconductor Manufacturing (TSM) controls advanced packaging capacity that determines which AI chipmakers can scale production. Google reportedly cut its 2026 TPU production target ...

Amid intense competition from Chinese suppliers and a maturing consumer electronics market, Taiwan-based panel provider Innolux is pursuing transformation through its "More than Panel" strategy. The ...

BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot production line project.

The centre will provide essential infrastructure and public services to support semiconductor design and prototyping as part of Vietnam’s broader industrial strategy.