For many recent generation power semiconductors, package innovation makes a significant contribution to key performance parameters. In the case of HV MOSFETs, high-speed hard-switching transitions are ...
Using a WPAK3 package allows the RJK0380DPA dual-type power MOSFET to reduce the chip-mounting area by half, compared with a dual-package power-MOSFET configuration. In a synchronous-rectification ...
The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands SUNNYVALE, Calif.--(BUSINESS WIRE)--Alpha and Omega ...
The AOLV66935 designed by Alpha and Omega Semiconductor is a 100V N-channel High Safe Operating Area (SOA) MOSFET ...
Now available from multiple sources, a 3.3-mm x 3.3-mm MOSFET package reduces pc-board space requirements by up to 63% versus the SO-8, while offering similar thermal and electrical performance. Spiro ...
The MOSFETs in these packages are intended for e-mobility and industrial applications that require high current capabilities and efficient thermal performance Alpha and Omega Semiconductor (AOS) has ...
Mitsubishi Electric Corporation announced it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of ...
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the first power MOSFET drivers in a new product family—the MCP14A005X and ...
Magnachip Semiconductor has brought out an 80V MXT MV MOSFET, MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package. Unlike conventional TOLL (TO-Leadless) packages that dissipate heat ...
With the TO-Leadless (TOLL) package, Infineon offers two more OptiMO power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the ...
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