An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...
Samsung has announced that it has begun mass production of the industry’s first ePOP memory, which could result in cost and space savings in future high-end smartphone production. ePOP stands for ...
Intel’s upcoming Meteor Lake processors will be the company’s first chips manufactured using a new Intel 4 process, which the company says will bring improvements in performance and efficiency.
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