A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...
Forge Nano’s 200 mm single-wafer, thermal atomic layer deposition (ALD) platform for compound semiconductor manufacturing to be unveiled in Taipei Tool build slots available with delivery expected in ...
Tower Semiconductor and Innolight have announced an expanded collaboration focused on high-volume production of optical modules utilizing Tower's new Silicon Photonics (SiPho) technology. This ...
L&T Semiconductor Technologies is expected to outline a partner-led expansion into cellular IoT modules at CES, positioning India as a future manufacturing base and sourcing option in a market long ...
By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...
Silicon carbide (SiC) continues to carve out a place for itself in power electronics after decades of dominance by silicon. SiC-based power switches are becoming the gold standard in the three-phase ...
GATEWORKS GW16167 next-generation Wi-Fi HaLow M.2 module is built with the Morse Micro MM8108 chipset. The USA-made device delivers long-range connectivity, ...
IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
SAN JOSE, Calif.--(BUSINESS WIRE)--High efficiency and power density are critical factors that designers are challenged to provide within the shrinking available board space in next-generation server ...
Avnet Internix, a subsidiary of Avnet’s global Electronics Marketing group (Avnet EM) and ROHM Semiconductor (ROHM), a Japanese IC manufacturer have collaborated to jointly design and develop a power ...
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