New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...

Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which will accelerate ...

The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...

"Until about 10 years ago, standardized semiconductors were used, but now, as customized products have increased, packaging is also increasingly demanded to be customized. In the process of developing ...

Intel Corporation INTC is set to revolutionize the industry with the ground-breaking launch of glass substrates for advanced packaging of chips. This industry-leading product is likely to be available ...

KAOHSIUNG, Aug. 28, 2025 /PRNewswire/ -- As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 ...

Penn State has purchased a ClassOne Technology Solstice S8 single-wafer system for advanced device packaging R&D using glass substrates, extending ClassOne's longstanding relationship with the ...