In this interview, Tim Skunes from CyberOptics Corporation talks to AZoM about their 3D optical inspection technology, and how it can be used to solve challenges in SMT electronics manufacturing.

The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power ...

We’ve previously identified the convergence occurring between surface mount technologies (SMT), used to connect packaged semiconductor devices on printed circuit boards, and advanced packaging (AP) ...

As one of the most widely adopted 3D sensing techniques, fringe projection profilometry (FPP) reconstructs the depth information of a scene from stereo images taken with sequential structured ...