Semiconductor Plating Systems Market to Reach $7.83 Billion by 2030, Dominated by Applied Materials, Solvay, Tokyo Electron

Key market opportunities include the rise of AI-driven manufacturing, growing demand for EVs enhancing use of precise ...
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LG Innotek begins mass production of plating-free smart IC substrate cutting emissions

LG Innotek said on the 10th that it has developed a "next-generation smart integrated circuit (IC) substrate" that boosts performance while cutting carbon emissions to half of previous levels. It is ...
Business Wire

Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Semiconductor Engineering

Scaling Bump Pitches In Advanced Packaging

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...
EDN

Impact of PCB plating Finish on Elastomer Socket Technology

Impact of PCB plating Finish on Elastomer Socket Technology Ila Pal – Ironwood Electronics Introduction Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below ...