EDN

Applied drives CMP process control down to 45 nm and smaller

To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...
CIOL

Applied Materials takes CMP process control to 45nm and beyond

SANTA CLARA, USA: Applied Materials Inc. announced its new Applied FullVision System that enables real-time control of dielectric CMP1 processes to the 45nm device node and beyond. The FullVision ...
Silicon Semiconductor

Preventing liquid cross-contamination in semiconductor manufacturing

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...
AZOM

CMP Process: Online Monitoring of Hydrogen Peroxide

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...
AZOM

Using White Light Interferometry to Characterize CMP Processes

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...