Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs
This company has developed a negative photo-definable polyimide sheet for glass-core substrates in used to connect chips to ...
Dublin, Dec. 17, 2019 (GLOBE NEWSWIRE) -- The "High-Temperature Composite Resins Market by Resin Type, by End-Use Industry Type, by Manufacturing Process Type, and by Region, Trend, Forecast, ...
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