Sumitomo Bakelite Co. (Tokyo) announced plans to acquire all shares of a company newly established by Kyocera Corp., and ...
OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it developed a semiconductor encapsulation material for power devices that boasts the industry's top-class *1 heat-resistance ...
Dow (NYSE: Dow) will preview its latest silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021 in Booth #I2616. These next-generation silicone-organic hybrid adhesives, ...
The PV industry is experiencing rapid technological evolution. Emerging cell technologies are driving deeper synergy between PV modules and encapsulation materials. While different technical routes ...
SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and ...
SAN JOSE, Calif. — Following possible shortages and supply-chain disruptions in the market, Japan's Shin-Etsu Chemical Co. Ltd. (SEH) has recently increased the prices for its epoxy molding ...
The global Fully Automatic Semiconductor Molding System market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, growing at a CAGR of % during the forecast period. The ...
DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/4793np/opportunities_of) has announced the addition of the "Opportunities of ...
SHANGHAI, Dec. 10, 2025 /PRNewswire/ -- USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high–aspect ratio copper pillar mass-transfer ...
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