As integrated circuit (IC) designs continue to scale, the demand for efficient power management, performance optimization and reliable physical layout modification grows more critical. Meeting these ...

The objective of the 3D-SCALO problem is to assign the given components to optimal mounting surfaces and position them at the best locations, while satisfying the requirements for (1) heat dissipation ...

Running a warehouse isn’t a walk in the park. Between juggling inventory, coordinating team members, and trying to stay ahead of orders, it can feel like there’s always a fire to put out. But one of ...

The implementation flow for semiconductor devices is all about optimizing for power, performance, area (PPA), or some combination of these attributes. The history of this flow in electronic design ...