Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to ...
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MIT’s chip stacking leap could slash energy use for hungry AI chips
Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
At a memory conference this week, semiconductor giant Samsung updated its roadmap with several ambitious technologies. Those include 3D DRAM and stacked DRAM, which it says could arrive this decade.
Manufacturing fast, efficient 8051 core with patented vertical connection and wafer stacking technology produces processor with triple the typical speed May 19, 2005, Shinagawa,Tokyo — IP Japan — ...
A nanoelectronics research institute has announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. Scientists recently demonstrated the first functional 3D integrated ...
Leuven, Belgium – October 13, 2008 – IMEC, Europe’s leading independent nanoelectronics research institute today announced that it has made significant progress with its 3D-SIC (3D stacked IC) ...
At a high-performance computing event this month AMD has given a little more detail about the 3D chip-stacking techniques it's looking at to mitigate the slowing of Moore's Law. The multi-chip, or ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
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