LONDON — Fujitsu Ltd.'s semiconductor division today announced development of a high-density, multi-chip package capable of holding up to eight stacked devices. The company said it is using a new chip ...
SAN JOSE — Fujitsu Microelectronics America Inc. today said it was offering the industry's first four-stacked multi-chip package, which is designed to hold a pair of 64-megabit NOR-based flash memory ...
New information has emerged about AMD’s next generation desktop “Carrizo” APUs. We already know so far that Carrizo will be arriving in 2015, it will make use of AMD’s Excavator CPU core architecture, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback