DUBLIN–(BUSINESS WIRE)–Feb 8, 2021– The "System in Package Technology Market Forecast to 2027 – COVID-19 Impact and Global Analysis By Packaging Technology; by Packaging Type; Interconnection ...
A new technical paper titled “Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration” was published by researchers at University ...
Microchip’s SAMA7D65 MPU runs 1 GHz Arm® Cortex®-A7 core and integrates MIPI DSI®, LVDS display interfaces and 2D GPU for Human-Machine Interface (HMI) applications CHANDLER, Ariz., Feb. 26, 2025 ...
The industry’s first automotive-grade Local Interconnect Network(LIN) System-in-Package (SIP) solution including a microcontroller with integrated touch hardware support is now available from ...
A new technical paper titled “GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package” was published by researchers at University of Florida and University of Central Florida. “A ...
Spectrum Control has unveiled a new RF front-end system-in-package (SiP) platform as part of its SCi Blocks family. The SCRS series RF+ SiP with integrated digital control addresses size and ...
STMicroelectronics has released its ST53G system-in-package (SiP). The solution consists of an integrated secure element (SE) and RF booster, in the same package, that can be built into wearable ...
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in system-in-package (SiP) modules, has announced plans to open a subsidiary in Vietnam for US$20 million. The ...
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