EDN

Novellus Develops Advanced Copper Seed Technology for Through-Silicon-Via (TSV) Packaging

SAN JOSE, Calif., March 8 /PRNewswire-FirstCall/ — Novellus Systems (Nasdaq: NVLS) today announced that it has developed a new, advanced copper barrier-seed ...
GIGAZINE

Samsung develops industry's first 512GB DDR5 memory

Samsung announced that it has developed the industry's first 512GB DDR5 memory. This DDR5 memory uses HKMG technology and an 8-layer through silicon via (TSV) structure, achieving a maximum data ...
EDN

Novellus develops advanced copper seed technology for through-silicon-via (TSV) packaging

San Jose, California – March 8, 2010 – Novellus Systems (NASDAQ: NVLS) today announced that it has developed a new, advanced copper barrier-seed physical vapor deposition (PVD) process for the ...