Heat management is becoming crucial to an increasing number of chips, and it’s one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the ...

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...

SEOUL, South Korea, March 15, 2021 /PRNewswire/ -- Magnachip Semiconductor Corporation ("Magnachip") (NYSE: MX) announced today that the company has released a new Low-dropout (LDO) linear regulator ...

Power-semiconductor devices such as thyristors, MOSFETs and IGBTs operate in a high current-density mode in which they dissipate a high level of power, with heat-dissipation management becoming a ...

NeoGene Tech, a Guangzhou-based Taiwanese thermal management solution provider, has in Q3 2022 supported Xiaomi to successfully launch its flagship 5G smartphone, Xiaomi 12S Ultra, with excellent ...

COSTA MESA, Calif., May 16, 2024 /PRNewswire/ -- Viking Technology, a division of Sanmina Corporation (SANM), announces their newly released 16GB DDR4 Multi-Chip Package (MCP). This high-density MCP ...

Forbes contributors publish independent expert analyses and insights. I write about disruptive companies, technologies and usage models. The bane of every notebook processor has been its thermal ...

ARLINGTON, Va., Feb. 1, 2024 /PRNewswire/ -- Raytheon, an RTX (RTX) (NYSE: RTX) business, has been awarded a $20 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted ...

NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...