MUNICH, May 29, 2024 /PRNewswire/ -- ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from its ...
San Mateo, Calif. – Ziptronix Inc., a startup spun from the Research Triangle Institute (Research Triangle Park, N.C.), introduced an “engineered substrate” material last week for use in ...
Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...
Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of ...
MUNICH, May 29, 2024 /PRNewswire/ -- ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from its ...
ERS's new Luminex machines offer a unique solution for stress-free debonding, saving more than 30% in operation costs compared to traditional laser debonding. They are engineered with robust wafer ...
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