Metamaterials—the term may sound esoteric to the layman. In science and engineering, however, this is an interesting field of research that has developed at a highly dynamic pace, particularly since ...

Today’s leading-edge chip designs require a new class of metrology that goes beyond optical target-based approximation, statistical sampling and single-layer control PROVision® 3E system combines ...

Two-dimensional (2D) semiconductors, materials that can conduct electricity and are only a few atoms thick, are promising alternatives to the conventional silicon-based semiconductors currently used ...

When existing advanced 2D designs already push the limits of design-for-test (DFT) tools, what hope do developers have of managing DFT for 3D devices? Can anyone afford the tool run time, on-chip area ...

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...

Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming ...