January 10, 2024 -- Global Unichip Corporation (GUC), a leading global ASIC provider, has successfully taped out a complex 3D stacked die design on an advanced FinFET node process. The design, which ...
Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to ...
Manufacturing fast, efficient 8051 core with patented vertical connection and wafer stacking technology produces processor with triple the typical speed May 19, 2005, Shinagawa,Tokyo — IP Japan — ...
Morning Overview on MSN
MIT’s chip stacking leap could slash energy use for hungry AI chips
Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
Something to look forward to: There have been a lot of revelations at Intel's Innovation 2023 event, including confirmation that the company will follow a similar path as AMD by using 3D-stacked cache ...
Synopsys unveiled an EDA-based solution for stacked multiple-die silicon systems that exploits 3D IC integration. Available now in beta, it includes enhanced versions of the company’s IC ...
As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results